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Vacuum Chamber for 2K Potting Applications
A Vacuum Chamber for Potting Machine is used to remove trapped air & air Bubble from electronic components and resin materials during the potting or encapsulation process. It helps achieve void-free, bubble-free, and reliable potting results, especially for components with narrow gaps, coils, sensors, transformers, connectors, PCB assemblies, and EV electronics.
The chamber works by creating a controlled vacuum environment After material dispensing. This allows air bubbles inside the component or resin to escape, improving material penetration, insulation strength, thermal performance, and long-term product reliability. Vacuum potting is widely used when normal atmospheric potting may leave air pockets or incomplete filling.
Key Features
- Controlled vacuum environment for bubble-free potting
- Suitable for epoxy, polyurethane, silicone, and filled resins
- Helps remove air entrapment and moisture from components
- Improves resin flow into complex cavities and narrow gaps
- Supports precise potting, encapsulation, casting, and sealing
- Compatible with 1K and 2K dispensing systems
- Can be integrated with robotic dispensing systems
- PLC and HMI-based control for easy operation
- Optional vacuum level monitoring and recipe settings
- Transparent viewing window for process observation
- Safety interlock system for operator protection
- Available in manual, semi-automatic, and fully automatic models
- Suitable for batch processing or inline production
Key Specification
| Specification | Value |
| Compatible Material | Epoxy, Polyurethane, Silicone and Other Resins |
| Vacuum Range | Up to -90kpa |
| System Control | PLC based |
| Program Interface | HMI |
| External I/O | Yes |
| Ethernet Communication | Yes |
| Power | 220 VAC Single Phase |
| Dimensions | L W H – 1200 x 1200 x 1800 mm |
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